David L. Wilcox

Motorola

Integration of radio frequency (RF) circuit functions in three dimensional ceramic structures" This is a newly emerging application of an "old" multilayer ceramic fabrication technology where new materials appropriate to the RF world and the ability to integrate the conductor, capacitor, inductor, resistor, magnetic and other materials is essential. We call this thrust the multilayer ceramic integrated circuits and the challenges are very analogous to the semiconductor integrated circuit world in many respects. There is a great need for directed research/science in advancing this technology thrust: dielectric electrical properties at 0.5 to 6 GHz, thermal/mechanical modeling of these complex structures, modeling of the sintering behavior of these multilayer structures and understanding of the rheological properties that control the thick film deposition behavior and the properties of the "ceramic green sheets" are just some of the challenges gating the full implementation of this thrust.